CISDI and HUAWEI join forces to bring hi-tech to steel manufacture
Date:2019/7/17 Source: CISDI
CISDI
and HUAWEI join forces to bring hi-tech to steel manufacture
Strategic co-operation agreement will push
forward new technology for intelligent steel manufacturing
Two of China’s
biggest enterprises are now working hand-in-hand to create major new
technological advances which will
transform the country’s steel industry.
CISDI and
HUAWEI have consolidated their working relationship by signing a strategic
co-operation agreement.
The document
was signed in early June, eight months after the Chinese giants signed their
first agreement on achieving mutual goals.
CISDI leads
China’s engineering sector when it comes to applying information technology to
management systems, and has taken the lead on developing systems for steel
intelligent manufacturing, smart city and smart agriculture.
A leading
global provider of information and communications technology, infrastructure
and smart devices, HUAWEI has been focused on ICT infrastructure and
intelligent terminals. The tech giant is committed to building a world-class
open public cloud which will enable global offline services.
The latest
agreement will see the two companies collaborate across-the-board on cloud
computing, internet of things, 5G, big data, artificial intelligence, chip and
the industrial internet. Their aim is to apply their new technologies to
intelligent steel manufacturing and the smart city.
CISDI’s 61
years of expertise and experience will be ploughed into HUAWEI’s chip
development, a Chinese first which will link to a
corporate cloud.
Both parties
will jointly conduct studies on the standards for industrial big data,
formulating an access standard and setting a benchmark for the industry.
CISDI and HUAWEI representatives at the signing
of the new agreement